Quik-Pak
Microelectronic Packaging & Assembly Solutions
Nobody from this business manages this page yet.
Quik-Pak, specializes in advanced IC Assembly and Prototyping services for fabless semiconductor companies, enabling faster time to market for new devices. The company offers Packaging and Assembly services in 24 hours or less. Quik-Pak also offers complete Wafer & Die Preparation services, including Backgrinding, Dicing, Bumping, Pick & Place and Inspection. The company's Advanced Assembly services meet the unique requirements for Flip Chip, Chip-on-Board (COB), Stacked Die, Multi-Chip Module (MCM), System-in-Package (SIP), Ceramic, BGA and MEMS devices. Custom Assembly services include Die Bonding, Gold Wire Ball Bonding, Encapsulation & Remolding and Marking. Quik-Pak's Laser Micromachining capability creates vast opportunities for package customization through drilling, cutting and marking of almost any material. Quik-Pak is the ideal partner for Advanced IC Assembly and Prototyping, providing unparalleled flexibility, quality and outstanding customer service.
- Team
- 1
- Industry
- Packaging
- Based in
- San Diego, CA, United States
What they can do
The stages of production this manufacturer takes on.
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01
Production
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02
Sample-Making
What they make
1- Bulk & Industrial
- Specialities 9
- Assembly · die · fabless · microelectronic · packaging · preparation
Specialities
- Assembly
- die
- fabless
- microelectronic
- packaging
- preparation
- Prototyping
- semiconductor
- wafer
San Diego
CA, United States
Packaging manufacturing
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