I2a Tech

i2a Technologies is engaged principally in the development and assembly activities related to QFP, BGA, fpBGA, CSP, SIP, QFN / DFN, Wafer bumping, WLCSP, COC (chip on chip) and multi-chip packaging technology, using both wire-bonding as well as flip-chip interconnect technologies. We provide miniaturization technologies for the electronics industry. As such, we enable improvements in miniaturization and performance by applying our expertise in the electrical, thermal and mechanical properties of materials and interconnect. Our intellectual property, covers a range of advanced semiconductor packaging and interconnect solutions. We build our customer's products based on miniaturization technology as well as license the technology to others, enabling them to produce semiconductor chips that are smaller and faster, and incorporate more features. This technology also enables multiple chips to be stacked vertically in a single three-dimensional multi-chip package that occupies almost the same circuit board area as a CSP. In addition, this technology allows a plurality of semiconductor chips and passive components to be densely combined in ultra-compact electronics modules. By reducing the size of the semiconductor package and shortening electrical connections between the chip (IC) and the circuit board, our technology allows further miniaturization and increased performance and functionality of electronic products. We achieve these benefits without sacrificing reliability. These semiconductors are utilized in a broad range of electronic products as well as other markets such as Medical, Mil-Aero, Aerospace, Communication, Automotive, Commercial, including digital audio players, digital cameras, personal computers, personal digital assistants, video game consoles and mobile phones. By using i2a technology and services, our customers are able to reduce the "time-to-market" and development costs of their new semiconductors.